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2021-09-05 09:23:01
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Jason Cook
jason@hub.inktada.com
Here's the electronics design and bay design for my high powered rocket named "Next". Wiring is security shielded and zip tied and/or glued at ends. Security shielding reduces chances of radio frequency interference since I have strong transmitters.
Primary deployment is carried out by custom electronics that are connected via bluetooth to phone. Battery is on the backside of the bay.
Backup deployment is carried out by raven4. Battery is to the left of the Raven4.
Battery on backside powers the custom deployment circuit. Independent heavy duty power switches engage the deployment circuits. This is the side that the phone is placed.
Like real rockets, I have epoxied down the soldering on the circuit board.
These traces are frozen in place. To epoxy, I placed masking tape along the perimeter and on the front-side to inhibit leakage of the epoxy.
My skills for soldering are improving. This circuit-board utilizes arduino nano ble with darlington arrays to engage the ematches.
Straps are 1/4" kevlar and both the bottom loop and top loop are a single rope. The kevlar is epoxied to the interior side of the bay. The cardstock tubing is hardened by using superglue.The wiring to the ematches that fire pyro is carried to the outside of the bay by bolts seen and using model train style knurled knobs with washers to tie down the match wires. The phone's 4K video camera aligns with the view window. I don't currently have the phone in place, so you can see the 9V battery in the view window.
Next
High Powered Rocketry
Electronics
1
Marshall Sutherland
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